Loading...

Gudeng Precision Industrial Co., Ltd.

New Taipei City,  Taiwan
http://www.gudeng.com.tw
  • Booth: 5569

https://www.gudeng.com/

Overview

Gudeng Precision Industrial Co., Ltd is a critical material technology provider comany. Founded in 1998, Gudeng has been a leading Taiwanese key manufacturer and service provider in semiconductor manufacturing industry for more than 20 years.

Gudeng offers a wide range of total solutions to our customers and business partners. Our products include EUV reticle POD, RSP 150, RSP 200, Reticle Shipping Box, and 4~18" Wafer carriers. We also provide services to customers such as carrier cleaning and contamination tests. Gudeng also offers on-site services at customer’s production sites to help customer clean carriers and provide after-sales services for equipment.

For more information, please visit our website at https://www.gudeng.com/


  Products

  • Light Cassette 12(in.)
    Provides 300mm wafer frame with high-efficiency protection during transportation and storage. Low-outgassing material can effectively reduce the risk of wafers being contaminated due to outgassing....

  • 1.Low outgassing material: reduce outgassing to pollute the wafer.
    2.ESD static dissipative material: preventing the wafer from being damaged by static electricity. 
    3.Support OHT.
    4.Support RFID funtion.
    5.Support purge funtion.
    6.Selectable items:
       Purge hole and quantity: customized design

    • Size

    300mm (12 in.)

    • Material

    PC(ESD)

    • Piece

    13 Piece

  • EUV POD
    The dual-layer design of the box provides high-efficiency protection for the transportation and storage of 6-inch EUV reticles between process stations. The inner EIP can be operated in a vacuum environment....

  • Supports purge function to control the temperature and humidity of the micro-environment inside the reticle carrier box.

    1. Comply with SEMI specification

    2. Support OHT function

    3. Support RFID function

    4. Dual-layer design: EOP (outer layer) and EIP (inner layer)

    5. EOP uses static dissipative and low outgassing materials

    6. EIP can be operated in a vacuum environment

    7. The contact points with the reticle are all wear-resistant materials: effectively reduce particle generation

    8. Excellent air tightness

    9. Selectable items-EIP form: with pellicle reticle version/without pellicle reticle version

    • Size

    6 x 6 x 0.25 (in.)

    • Material

    PEEK(ESD)、Metal

    • Usage

    Support purge function

    • Application

    Suitable for EUV process (ASML Certification)

  • 510x515 Panel
    Size -510mm x 515mm Panel Material -PC Piece -12,16...

  • Provides high-efficiency protection for 510x515 Panel during transport and storage. The excellent air tightness and purge function can maintain the inside of the FOUP in a clean environment, effectively reduce the risk of Panel being contaminated due to outgassing.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".